UP-Microchip Packaging Cleanroom Renovation
CURRENT - Bid Package #2: Cleanroom renovation and expansion at Millennium Sciences Building.
AWARDED - Bid Package #1: Construction of the new micro-electronic systems packaging research laboratory.
The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0) has announced the creation of a new Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES).
The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0) has announced the creation of a new Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES). The focus of this research is to collaborate to advance the effective integration and packaging of semiconduction devices, chips, and other components. Two new advanced research facilities are required to support the EE Department’s new research goals. The purpose of this project is to complete the design of the new micro-electronic systems packaging research laboratory and determine the anticipated construction cost.
| Package Number | Package Name | Pre-Bid Date/Time | Pre-Bid Meeting | Bid Date/Time | Awarded To | Document |
|---|---|---|---|---|---|---|
| 1.01 | DA Mechanical and Plumbing | McClure Company | ||||
| 1.02 | DA Electrical | Top Ridge | ||||
| 2.01 | Misc. Metals, General Trades, Interior Partitions & Ceilings | Recommended but not Mandatory | ||||
| 2.02 | Cleanroom Wall Panel System | Recommended but not Mandatory | ||||
| 2.03 | Flooring & Tiling | Recommended but not Mandatory | ||||
| 2.04 | Painting | Recommended but not Mandatory | ||||
| 2.05 | Fire Protection | Recommended but not Mandatory |